Cyient DLM Limited | Globe Capital Market LTD.
Cyient DLM Limited
Price Band
₹250 to ₹265 per share
IPO Issue Period
Jun 27, 2023 to Jun 30, 2023
Issue Size
₹592.00 Cr
Face value
₹10 per share
Fresh issue
₹592.00 C
Offer for sale
₹592.00 Cr
Minimum Shares for Retail
Listing on
Issue Type
Book Building
Registrar to the Issue
Kfin Technologies Limited
Tentative Listing Date
Monday, 10 July 2023

Incorporated in 1993, Cyient DLM Limited provides Electronic Manufacturing Services (EMS) and solutions.

The company provides Electronic Manufacturing Services as Build to Print (“B2P”) and Build to Specification (“B2S”) services. B2P solutions involve clients providing the design for the product for which the company provides agile and flexible manufacturing services. And, B2S services involve designing the relevant product based on the specifications provided by the client and manufacturing the product.

Cyient DLM’s solutions primarily comprise:

  1. Printed circuit board (“PCB”) assembly (“PCBA”),
  2. Cable harnesses, and
  3. Box builds which are used in safety critical systems such as cockpits, inflight systems, landing systems, and medical diagnostic equipment.

The company’s client list includes Honeywell International Inc. (“Honeywell”), Thales Global Services S.A.S (“Thales”), ABB Inc, Bharat Electronics Limited, and Molbio 152 Diagnostics Private Limited, and so on.

For year/ period ended ( in Cr.)

H1FY22 FY21 FY20
Total Revenue
Profit After Tax


  1. Funding incremental working capital requirements of the company,
  2. Funding capital expenditure of the company,
  3. Repayment/prepayment, in part or full, of certain of the borrowings,
  4. Achieving inorganic growth through acquisitions, and
  5. General corporate purposes.
Be a Part of IPO Success Stories!

Never Miss IPO Investment